V62-AEZ02-040031T OSFP 224G Connector Specifications and Applications

ElecSuppliers Part Number GuideSep 26, 2026

V62-AEZ02-040031T is an OSFP 224G high-speed connector from Amphenol. It is part of the ExtremePort OSFP interconnect family and is designed for high-density, high-speed applications including data centers, network switches, servers, and high-performance computing systems.

The connector uses a 60-position configuration with a 0.60 mm pitch. Its electrical interface supports eight high-speed lanes operating at up to 224Gb/s PAM4, providing an aggregate bandwidth of up to 1.6Tb/s per port.

The design is intended for next-generation pluggable optical and electrical interconnect systems where signal integrity, thermal performance, density, and mechanical reliability are critical.

V62-AEZ02-040031T Electrical Performance

V62-AEZ02-040031T supports 224Gb/s PAM4 signaling. The eight-lane electrical interface provides the bandwidth required for next-generation OSFP applications.

Published specifications for the connector include a differential impedance of approximately 92Ω ±10%. The operating voltage is specified at up to 30VDC per contact, while the operating current is specified at 0.5A per signal contact and 2.5A per power contact.

These characteristics allow the connector to support high-speed data transmission while also providing power connections for the connected OSFP module.

V62-AEZ02-040031T 224G PAM4 Interface

PAM4 signaling is used to increase data throughput by transmitting four signal levels instead of the two levels used by conventional NRZ signaling. This allows more data to be transmitted per symbol while maintaining the physical interface within practical electrical limits.

At 224Gb/s per lane, signal integrity becomes a major consideration in connector design. Crosstalk, insertion loss, return loss, impedance control, and mechanical tolerances can all affect system-level performance.

V62-AEZ02-040031T is designed specifically for this high-speed environment and provides an OSFP interface suitable for next-generation network architectures.

V62-AEZ02-040031T Package and Mechanical Design

V62-AEZ02-040031T is a surface-mount connector designed for PCB assembly. The 60-position contact arrangement uses a 0.60 mm pitch to provide high contact density within a compact OSFP interface.

The connector uses a copper-alloy contact structure and a high-temperature LCP housing with UL 94 V-0 material characteristics. The solder interface is designed for reflow assembly.

The connector is also designed for repeated module insertion and removal. Published specifications indicate a durability rating of up to 100 mating cycles for the referenced configuration.

V62-AEZ02-040031T Thermal Management

High-speed OSFP modules can generate significant heat, particularly in high-density data center and networking equipment. Thermal management is therefore an important part of the complete OSFP interface.

The V62-AEZ02-040031T system can be used with compatible cage and heat-sink configurations. The mechanical design allows thermal solutions to be integrated around the OSFP module while maintaining the required high-speed electrical connection.

System designers should evaluate the connector, cage, heat sink, module, airflow, and PCB together rather than treating the connector as an isolated thermal component.

V62-AEZ02-040031T Signal Integrity

Signal integrity is one of the most important considerations when using a 224G OSFP connector.

At 224Gb/s PAM4 speeds, even small impedance discontinuities can affect signal quality. PCB traces, vias, connector contacts, cage structures, module interfaces, and transmission paths must therefore be considered as part of the complete channel.

Engineers should follow the recommended PCB footprint and routing requirements and evaluate insertion loss, return loss, crosstalk, and other high-speed parameters during system validation.

V62-AEZ02-040031T Applications

V62-AEZ02-040031T is designed for high-speed networking and data communication equipment. Typical applications include data center switches, high-performance servers, network routers, optical transport equipment, high-performance computing systems, and next-generation Ethernet platforms.

The connector can support OSFP modules used with passive copper cables, active copper solutions, and optical interconnects.

Its high bandwidth also makes the OSFP 224G platform suitable for applications associated with 800G and emerging 1.6T networking architectures.

V62-AEZ02-040031T OSFP Compatibility

The OSFP form factor provides a standardized mechanical and electrical approach for high-speed pluggable modules. V62-AEZ02-040031T is designed around the OSFP 224G interface and supports the ExtremePort ecosystem.

The connector design also provides backward mating compatibility with certain 56G and 112G OSFP module generations, allowing system designers to consider platform compatibility when developing network hardware.

Actual compatibility depends on the complete cage, module, thermal structure, electrical interface, and system design.

V62-AEZ02-040031T PCB Design Considerations

Because V62-AEZ02-040031T is intended for 224G signaling, PCB design must maintain controlled impedance and minimize signal discontinuities.

The recommended land pattern should be followed carefully during PCB layout. High-speed differential pairs should be routed with appropriate spacing and controlled geometry, while unnecessary vias and abrupt routing changes should be avoided where possible.

Power contacts should also be designed according to their current requirements. Thermal and mechanical clearances around the connector must be considered when integrating the OSFP cage and heat sink.

V62-AEZ02-040031T Operating Conditions

Published specifications for the connector indicate an operating temperature range of approximately -40°C to +85°C. The connector is designed for demanding networking environments where both electrical and mechanical reliability are required.

The actual system operating temperature depends on the complete equipment design, including module power consumption, airflow, heat-sink configuration, PCB temperature, and enclosure conditions.

V62-AEZ02-040031T Sourcing

When sourcing V62-AEZ02-040031T, buyers should confirm the complete Amphenol part number because OSFP 224G connector families can include different cage configurations, heat-sink options, orientations, and mechanical structures.

For production procurement, buyers should specify the exact part number, required quantity, packaging requirements, target delivery schedule, and any applicable quality requirements.

Because high-speed OSFP connectors are used in specialized networking equipment, it is important to verify the connector's mechanical configuration and electrical characteristics before approving an alternative part.

V62-AEZ02-040031T for Data Center Networks

V62-AEZ02-040031T provides a high-density OSFP interface for next-generation networking equipment. Its 60-position 0.60 mm pitch structure, 224Gb/s PAM4 signaling, eight-lane architecture, and support for up to 1.6Tb/s aggregate bandwidth make it suitable for high-speed data center and communications infrastructure.

For new designs, engineers should evaluate the complete high-speed channel, including the connector, cage, OSFP module, PCB, thermal solution, and cable or optical interface, to ensure that the required system performance can be achieved.